The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through numerical control.
Our edge grinders are attracting attention as requirements become more stringent for precision and processing quality of wafer edge and circumference. They are also attracting attention as the measures for knife edge to improve the yield in the device process.
We provide solutions for various requirements from customers and challenges with our edge grinders.
●Applicable to a wide range of wafer sizes from 2-inch to 8-inch and materials
●1 or 2 grinding stage(s)
●4 cassettes as standard (Options available)
●High precision beveling with forming grinding wheels inheriting the conventional numerically controlled grinding
●Compact design
●Capable of connecting to network
| Daitron Co., Ltd. | |
|---|---|
| Product Category | Grinders and Grinding Machines |
| Product Number | WBM-2000A Series |
| Product Name | Wafer Edge Grinders |
| Type | Grinder; Edge or Platen; Precision |
