Samsung Electro-Mechanics Datasheets for IC Interconnect Components
IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
IC Interconnect Components: Learn more
| Product Name | Notes |
|---|---|
| High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. The products are used... | |
| The product is a high-integration package substrate that is used to connect a high-integration semiconductor chip to a main board. This is a high-integration package substrate developed by connecting a... | |
| This is a semiconductor chip the size of which is more than 80% of that of the finished part. It is called WBCSP (Wire Bonding CSP) as a gold wire... | |
| This is a semiconductor chip with a size that is more than 80% of the finished part. It is called FCCSP (Flip Chip CSP) as flip chip bumps are used. | |
| This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no... |