Samsung Electro-Mechanics Datasheets for IC Interconnect Components
IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
IC Interconnect Components: Learn more
| Product Name | Notes |
|---|---|
| HDI(High Density Interconnection) | High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. The products are used... |
| FCBGA(Flip Chip Ball Grid Array) Package Substrate | The product is a high-integration package substrate that is used to connect a high-integration semiconductor chip to a main board. This is a high-integration package substrate developed by connecting a... |
| WBCSP(Wire Bonding Chip Scale Package) Package Substrate | This is a semiconductor chip the size of which is more than 80% of that of the finished part. It is called WBCSP (Wire Bonding CSP) as a gold wire... |
| FCCSP (Flip Chip-Chip Scale Package) Package Substrate | This is a semiconductor chip with a size that is more than 80% of the finished part. It is called FCCSP (Flip Chip CSP) as flip chip bumps are used. |
| Rigid-Flex | This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no... |