Samsung Electro-Mechanics Datasheets for IC Interconnect Components

IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
IC Interconnect Components: Learn more

Product Name Notes
HDI(High Density Interconnection) High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. The products are used...
FCBGA(Flip Chip Ball Grid Array) Package Substrate The product is a high-integration package substrate that is used to connect a high-integration semiconductor chip to a main board. This is a high-integration package substrate developed by connecting a...
WBCSP(Wire Bonding Chip Scale Package) Package Substrate This is a semiconductor chip the size of which is more than 80% of that of the finished part. It is called WBCSP (Wire Bonding CSP) as a gold wire...
FCCSP (Flip Chip-Chip Scale Package) Package Substrate This is a semiconductor chip with a size that is more than 80% of the finished part. It is called FCCSP (Flip Chip CSP) as flip chip bumps are used.
Rigid-Flex This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no...