The product is a high-integration package substrate that is used to connect a high-integration semiconductor chip to a main board.
This is a high-integration package substrate developed by connecting a semiconductor chip and a package substrate by using flip chip bumps.
General Features
Applicable for packages that require high performance and high I/O count
Enhances electric and thermal characteritics
Application
PC Application Processor, Baseband and others
Why Samsung
Features of Products (Technology)
The CPU substrates for PCs are high and have multiple layers. They are produced with high density because of the increase of the input/output signals through the matching between the layers. Moreover, the substrates for notebook PCs and tablet PCs have a reduction in their core thickness, making them available in thin sheets like the UTC (Ultra Thin Core) and coreless products.
The product is a high-integration package substrate that is used to connect a high-integration semiconductor chip to a main board.
This is a high-integration package substrate developed by connecting a semiconductor chip and a package substrate by using flip chip bumps.
General Features
- Applicable for packages that require high performance and high I/O count
- Enhances electric and thermal characteritics
Application
- PC Application Processor, Baseband and others
Why Samsung
Features of Products (Technology)
The CPU substrates for PCs are high and have multiple layers. They are produced with high density because of the increase of the input/output signals through the matching between the layers. Moreover, the substrates for notebook PCs and tablet PCs have a reduction in their core thickness, making them available in thin sheets like the UTC (Ultra Thin Core) and coreless products.
