Samsung Electro-Mechanics Rigid-Flex

This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no need to use connectors between modules, this substrate is advantageous in terms of miniaturization. It is also possible to increase the degree of freedom in design by maximizing the set space utilization. SEMBrid is the abbreviaiton of “SEM” + “Hybrid,” which refers to a multilayer rigid-flex substrate made by SEM. It is a hybrid substrate made by integrating a general rigid substrate and a flexible substrate. General Features Flexibility: Withstands 150,000 times of continuous flexing, and 50 times of one-time flexing High-density, thin, and various layer structures and designs Application Portable Appliance - Cellular Phone, Tablet, DSC, Game Consol Computer / Display - IC Module, Main Board, Note PC Why Samsung Features of Products (technology) 3-D wiring Equipment can be developed as compact and light, thanks to various types of 3-D wiring. Flexible wire formation Interlayer connection space excluded Space Saving When a rigid-flex PCB is used, the outer-layer FOB (FPCB on the board) area will not be needed, thereby reducing the substrate size. When the substrate size is reduced, the battery size can be increased and the bezel size can be reduced. Electrical Performance Contact noise from the outer-layer FOB (FPCB on the board) does not occur when an integrated rigid-flex PCB is used. The issue of noise occurrence at the pad contact site when sending high-resolution data has been resolved. According to the result of e-field analysis,in a Rigid / Flex separable structure where the FPCB comes into contact with the substrate, noise is generated at the bonding pad contact site. Furthermore, performance decreases when high-resolution data is sent. Reliability In aseparable substrate, delamination occurs at the bonding section, while in a rigid-flex type, the reliability of bonding is high because it is an integrated type. Cavity Type Cavity PCBs have step differences in the areas where components are mounted. They allow a reduction inthe overall thickness even if a thick component is mounted. There are two types of cavity the non-component type which cannot mount component inside the cavity. and the component type which can mount components due to the formation of Sralc Pad. Non Component Type Reducing thickness of specific area High Volume Manufacturing Depth : ~ 400 ㎛ Application Wearable Device Component Type Reduce the thickness of an assembled device ※ HDI desing rules remain the same (0.4 Pitch) Under Developing Depth : ~ 250 ㎛ Application - Smart Phone - Tablet PC / Note PC Pad type Realizes SMD pad and NSMD pad According to the mounting methods and the needs of customers, pad sizes are created based on each pitch. - SMD : Solder Mask Defined - NSMD : Non Solder Mask Defined Technology - Chip mounting BGA section register - Various materials, such as PSR ink, coverlay, and prepreg, can be used to form the register of the chip mounting section Key Core Technologies ProducesHDI/BGA/FCB products and develops leading technologies as well as generate synergy through the convergence and integration of the technologies of individual products 1) HDI : High Density Interconnect 2) BGA : Ball Grid Array 3) FCBGA : Flip Chip BGA Quality Has durability against repetitive flexing Folder Type: 100,000 times Slider Type: 200,000 times Ideal assembly process with high reliability Able to perform continuous production. Folder Type: 100,000 times Slider Type: 200,000 times