DESCRIPTION
Our Visual Blade Inspector (VBI) sensor, engineered to revolutionize wafer cutting operations, is designed for precision and reliability and continuously monitors blade performance during cutting, ensuring consistent quality and minimizing waste. With advanced sensor technology, it provides real-time measurement of blade wear and shape, reduces scrap, and seamlessly integrates into existing workflows.
The dicing process involves several fundamental aspects from the point of view of the sensor monitoring the blade. The sensor checks the position of the blade (NCS) to ensure that it is aligned correctly with respect to the wafer, because incorrect positioning can cause defects in the chips. We are significantly faster than the competition while maintaining excellent repeatability. During the process, the data collected by the sensor is analysed in real time to detect blade breakage (BBD), thus improving the quality of the cut and the overall efficiency of the process. The sensor also monitors the level of blade wear and can alert the operator or activate an automatic replacement system when the blade begins to wear.
Our sensor is connected to an electronic interface unit, which can handle two sensors at the same time: they can do the same function, or even two different functions.
BENEFITS
Advanced Monitoring enhances process reliability
NCS Cycle High speed for positioning with excellent repeatability
High Sampling Speed Images captured in rapid succession for up-to-date monitoring
Advanced BBD Algorithm : Quick detection of blade breaks with water filtration,reduced false alarms
Better Signal Transmission no fiber optics reducing issues related to fragility
Reduced Downtime With a range of 1.8mm minimises positioning times and optimises productivity
Simple Integration easily integrates with your machines without complex modifications
Intuitive Configuration Can be easly programmed through the integrated Web Server
Advanced features automatic operations for probe setup according to ambient light conditions
DESCRIPTION
Our Visual Blade Inspector (VBI) sensor, engineered to revolutionize wafer cutting operations, is designed for precision and reliability and continuously monitors blade performance during cutting, ensuring consistent quality and minimizing waste. With advanced sensor technology, it provides real-time measurement of blade wear and shape, reduces scrap, and seamlessly integrates into existing workflows.
The dicing process involves several fundamental aspects from the point of view of the sensor monitoring the blade.
The sensor checks the position of the blade (NCS) to ensure that it is aligned correctly with respect to the wafer, because incorrect positioning can cause defects in the chips. We are significantly faster than the competition while maintaining excellent repeatability. During the process, the data collected by the sensor is analysed in real time to detect blade breakage (BBD), thus improving the quality of the cut and the overall efficiency of the process. The sensor also monitors the level of blade wear and can alert the operator or activate an automatic replacement system when the blade begins to wear.
Our sensor is connected to an electronic interface unit, which can handle two sensors at the same time: they can do the same function, or even two different functions.
BENEFITS
- Advanced Monitoring enhances process reliability
- NCS Cycle High speed for positioning with excellent repeatability
- High Sampling Speed Images captured in rapid succession for up-to-date monitoring
- Advanced BBD Algorithm : Quick detection of blade breaks with water filtration,reduced false alarms
- Better Signal Transmission no fiber optics reducing issues related to fragility
- Reduced Downtime With a range of 1.8mm minimises positioning times and optimises productivity
- Simple Integration easily integrates with your machines without complex modifications
- Intuitive Configuration Can be easly programmed through the integrated Web Server
- Advanced features automatic operations for probe setup according to ambient light conditions
