Precision Polymer Engineering Ltd. Ultra-Pure O-Rings Nanofluor®

Nanofluor^® elastomers can be considered as hybrid materials, bridging a gap between the low cost of fluoroelastomer (FKM) and high cost of perfluoroelastomer (FFKM) polymer types.

The range includes a fully organic ultra-low outgassing material and an inorganic filled grade with unique nano-filler to reduce erosion rates. The nano-filled material provides a chemical inertness only seen in much more costly FFKM grades and been developed for plasma ash or resist strip, chlorine and CxFy based etch processes.

Nanofluor^® grades provide some of the lowest trace metal contamination levels available from elastomer seals and ultra-low permeation rates.

Key Material Attributes:

• Ultra pure with extremely low trace metal contaminants which may cause electrical yield problems.
• Excellent plasma resistance – ideal for most plasma chemistries except high F-radical processes.
• Plasma resistance comparable or superior to many competitive pure FFKM grades
• Low coefficient of thermal expansion
• Retro-fits existing O-ring grooves (including FKM & FFKM grooves)
• Low permeation
• Low out-gassing

Nanofluor^® elastomers can be considered as hybrid materials, bridging a gap between the low cost of fluoroelastomer (FKM) and high cost of perfluoroelastomer (FFKM) polymer types.

The range includes a fully organic ultra-low outgassing material and an inorganic filled grade with unique nano-filler to reduce erosion rates. The nano-filled material provides a chemical inertness only seen in much more costly FFKM grades and been developed for plasma ash or resist strip, chlorine and CxFy based etch processes.

Nanofluor^® grades provide some of the lowest trace metal contamination levels available from elastomer seals and ultra-low permeation rates.

Key Material Attributes:

• Ultra pure with extremely low trace metal contaminants which may cause electrical yield problems.
• Excellent plasma resistance – ideal for most plasma chemistries except high F-radical processes.
• Plasma resistance comparable or superior to many competitive pure FFKM grades
• Low coefficient of thermal expansion
• Retro-fits existing O-ring grooves (including FKM & FFKM grooves)
• Low permeation
• Low out-gassing