MacDermid Alpha Electronics Solutions Through-Silicon Via (TSV) Plating Solutions for Advanced packaging MICROFAB ® DVF-200

Product Overview MICROFAB DVF-200 is an acid copper plating process designed to fill TSVs without voids or other defects at high plating speeds. The process is specially formulated for vias with diameters ranging from 5 to 100 μm and aspect ratios of less than 10:1. Product Features Reduced Voids and Defects MICROFAB DVF-200 delivers exceptional bottom-up fill for Through-Silicon Vias. Versatile Solution MICROFAB DVF-200 is a versatile solution that exhibits ease of use for a variety of aspect ratios. Featured Applications Through-Silicon Vias (TSV) MICROFAB DVF-200 is designed to accommodate a variety of aspect ratios for TSV and interposer applications.