MacDermid Alpha Electronics Solutions Redistribution Layer for Wafer Level Packaging BDT-510

Description
Product Overview BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3 g/cm³), indicating the absence of co-deposited polymers commonly found in other high-purity systems.
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Description
Product Overview BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3 g/cm³), indicating the absence of co-deposited polymers commonly found in other high-purity systems.
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Redistribution Layer for Wafer Level Packaging - BDT-510 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Redistribution Layer for Wafer Level Packaging
BDT-510
Redistribution Layer for Wafer Level Packaging BDT-510
Product Overview BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3 g/cm³), indicating the absence of co-deposited polymers commonly found in other high-purity systems.

Product Overview

BDT-510 is an alkaline, non-cyanide electroplating system that produces a bright, ductile deposit. The specific gravity of the deposit consistently approaches the theoretical density of pure gold (19.3 g/cm³), indicating the absence of co-deposited polymers commonly found in other high-purity systems.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number BDT-510
Product Name Redistribution Layer for Wafer Level Packaging
Chemical / Composition Tin Plating; Soft / High Purity
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