Product Overview
Delivering consistent selectivity on a wide variety of materials and catalysts, our final finish solutions enable more complex designs on low-cost molding composites. This easy-to-control process offers steady plating rates and predictable bath performance.
ENPLATE® LDS AU 301 is designed to operate at low metal concentrations, allowing manufacturers to reduce operating costs. Deposits exhibit exceptional solderability, contact resistance, and color uniformity.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | Enplate ® LDS AU 301 |
| Product Name | Molded Interconnect Device Plating |
| Chemical / Composition | Hard Nickel Plating; Silver Plating; Tin Plating |
