Product Overview
The MacuSpec VF Series via-fill copper metallization solutions have been the production-proven standard for more than 20 years, supporting electronic devices used worldwide. With tailored options to suit a wide range of High-Density Interconnect (HDI) applications, MacuSpec VF processes deliver the most stable and consistent via filling available in the market today.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | MacuSpec ™ VF Series |
| Product Name | Copper Via Filling Solutions for High Density Interconnect PCBs |
| Chemical / Composition | Copper Plating; Tin Plating |
