MacDermid Alpha Electronics Solutions Hybrid Bonding Materials for Advanced Semiconductor Packaging NOVAFAB ® NANOTWIN Cu

Product Overview NOVAFAB NANOTWIN Cu is a high-purity copper electroplating process which produces a <111> oriented deposit with a high fraction of nano-twinning. It is specially formulated for the fabrication of pillars or pads for wafer level packaging applications that require hybrid bonding. It enables low temperature, high reliability copper to copper interconnects for Die-to-Die (D2D), Die-to-Wafer (D2W), and Wafer-to-Wafer (W2W) bonding. Product Features Novel One-Part Additive System NOVAFAB NANOTWIN Cu is a ready-to-use solution designed for use with soluble or insoluble anodes and produces a <111> oriented crystal structure. Excellent Process Stability The NOVAFAB NANOTWIN Cu process yields excellent thickness distribution over the whole wafer surface for consistent electrical properties and bondability. Featured Applications Hybrid Bonding D2D, D2W, and W2W hybrid bonding for sub 40µm pitch packages enables 3D and chiplets, resulting in improved circuit efficiency and reduced power consumption.