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Shiu Li Technology Co., Ltd Thermal Conductive Putty H-PUTTY

Description
Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the H-putty series is 2.0/3.5/6.0 W/m*K.
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Thermal Conductive Putty - H-PUTTY - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Thermal Conductive Putty
H-PUTTY
Thermal Conductive Putty H-PUTTY
Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the H-putty series is 2.0/3.5/6.0 W/m*K.

Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the H-putty series is 2.0/3.5/6.0 W/m*K.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Synthetic Oils, Greases, and Lubricants
Product Number H-PUTTY
Product Name Thermal Conductive Putty
Type Grease / Gel
Type / Function Heat Transfer, Thermal Oil, Coolant
Composition / Chemistry Synthetic or Semi-synthetic; Silicone
Grade / Approvals REACH/RoHS
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