Henkel Adhesive Technologies - Aviation, Space and Rail Datasheets for Industrial Adhesives
Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more
| Product Name | Notes |
|---|---|
| BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low... | |
| BERGQUIST® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature... | |
| BERGQUIST® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low... | |
| BERGQUIST® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to... | |
| BERGQUIST® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of... | |
| LOCTITE ABLESTIK ICP 9000 is a silver-filled, semi-sintering adhesive specially designed for use in the assembly of high power and high temperature electronic devices. It is formulated with a more... | |
| LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI... | |
| LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. | |
| LOCTITE® ABLESTIK 8175 is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metallizations or traditional printed circuit board surfaces. It is capable... | |
| LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive Long... | |
| LOCTITE® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive High thermal conductivity Solvent-free formulation Low viscosity | |
| LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental... | |
| LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable | |
| LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic | |
| LOCTITE® EA 9365FST AERO is a FST retardant toughened paste that provides high color stability after curing. The product is Halogen- and Antimony-free and curable at room temperature or accelerated... | |
| LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint... |