Qnnect, formerly Hermetic Solutions Group Datasheets for Uncategorized Products
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| Product Name | Notes |
|---|---|
| Lead frames reside inside a chip package and are the metal structures that carry signals from the die to the outside. The die inside the package is typically attached to... | |
| Preforms are excellent solution for attaching electronic circuitry and packaging electronic devices. Preforms deliver good thermal and electrical conductivity as well as provide an interface for electronic connections. Alloy selection... | |
| Qnnect, formerly Hermetic Solutions Group manufactures precious metal evaporation pellets and sputter targets for the thin film coating industry. These products are used to coat dies, components, glass and other... | |
| Used as interconnect pads or bonding islands for gold and aluminum wire bond applications, wire bond tabs are a cost-effective and flexible technology used throughout the microelectronics industry. | |
| When a hermetic package design incorporates ceramic composition or high thermal conductivity material, Qnnect, formerly Hermetic Solutions Group is your "go to" for ring frames. Ring frames from Qnnect, formerly... |