PA&E offers vacuum brazing processes to join dissimilar materials such as titanium, alumina, Zirconia, and more.

Bonding Solutions for Electronic Packaging

Our experienced staff of material scientists and process engineers can meet the highest demands for quality — through finite control of these critical brazing processes. Our in-house vacuum brazing capabilities allow us to provide our customers with advanced metal-to-ceramic, metal-to-composite and metal-to-metal bonding solutions for use in fabricated components, electronic packaging and assemblies.

Brazing is the process of bonding two or more base materials with a liquid filler material at a temperature below the solidus of the base materials being bonded. The liquid filler material must have a liquidus temperature above 450°C and below the solidus temperature of the base materials.

Metal-to-Ceramic Bonding

• Titanium-to-Zirconia
• Invar-to-AIN

Metal-to-Composite Bonding

• Titanium-to-CuMo
• High thermal conductivity
• Low density
• Low CTE
• Connectors install via LBW
• Better strength-to-weight ratio than aluminum

Metal-to-Metal Bonding

• Stainless-to-Stainless
• Inconel-to-Stainless
• Cu/SS-to-Cu/Ti