Precision Surfacing Solutions Datasheets for Semiconductor Wet Process Equipment

Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing.
Semiconductor Wet Process Equipment: Learn more

Product Name Notes
4” - 12” Wafer Diameter Capacity. Process up to two (2) wafers simultaneously or choose insitu pad conditioning. Compact, space-efficient systems. True CMP processing without a CMP system price. Can...