The 633 Series of 13U AdvancedTCA systems is designed to the PICMG 3.0 AdvancedTCA specification. They support up to 14 slots at 30mm pitch front and rear with either a Dual Star or Full Mesh backplane topology. All of the systems in this series have front accessible cooling modules to optimize power dissipation while minimizing MTTR. The high performance thermal management system contained within the 633 Series is comprised of six dual fan modules configured in a push pull orientation to provide the required airflow to cool 200 watts front side and 30 watts back side. The 633 series also features a front removable NEBs filtered intake.
Construction:
22.75” (13U)H x 17.2” W x 18.2”D
Zinc plated steel
Black medium texture finish
EMI gasketing and hardware spacing to support FCC B
Card Cage
:
Formed sheet metal card cage with integral slot ESD clip
(14) 8U x 280mm front slots
(14) 8U x 100mm rear slots
Cooling:
Front removable/washable inlet filter
Push pull redundant cooling design with (3) dual fan modules above and (3) dual fan modules below the card cage
200 Watts Front Side Cooling
30 Watts Back Side Cooling
Power Entry
:
(2) DC Input PEMs
(1) -48VDC A
(1) -48VDC B
Rear pluggable into backplane
Designed to carry 60A
IPMI Controller and FRU Data Module
14 Slot AdvancedTCA Backplane Full Mesh Extended Fabric Interface 3.0Compliant with dual star base interface and fabric connectivity optimized for performance at 6.25 Gb/s and above:
(14) Full Mesh Node Slots
(2) Rear pluggable PEM interfaces
(2) Rear Pluggable System Management Modules
(2) Rear Pluggable Power Entry Modules
Shelf Management SMM04 (two per system):
Dual redundant shelf management modules
Rear pluggable
Pluggable into backplane
Based on Pigeon Point or Motorola technology
The 633 Series of 13U AdvancedTCA systems is designed to the PICMG 3.0 AdvancedTCA specification. They support up to 14 slots at 30mm pitch front and rear with either a Dual Star or Full Mesh backplane topology. All of the systems in this series have front accessible cooling modules to optimize power dissipation while minimizing MTTR. The high performance thermal management system contained within the 633 Series is comprised of six dual fan modules configured in a push pull orientation to provide the required airflow to cool 200 watts front side and 30 watts back side. The 633 series also features a front removable NEBs filtered intake.
Construction:
- 22.75” (13U)H x 17.2” W x 18.2”D
- Zinc plated steel
- Black medium texture finish
- EMI gasketing and hardware spacing to support FCC B
Card Cage
:
- Formed sheet metal card cage with integral slot ESD clip
- (14) 8U x 280mm front slots
- (14) 8U x 100mm rear slots
Cooling:
- Front removable/washable inlet filter
- Push pull redundant cooling design with (3) dual fan modules above and (3) dual fan modules below the card cage
- 200 Watts Front Side Cooling
- 30 Watts Back Side Cooling
Power Entry
:
- (2) DC Input PEMs
- (1) -48VDC A
- (1) -48VDC B
- Rear pluggable into backplane
- Designed to carry 60A
- IPMI Controller and FRU Data Module
14 Slot AdvancedTCA Backplane Full Mesh Extended Fabric Interface
3.0Compliant with dual star base interface and fabric connectivity optimized for performance at 6.25 Gb/s and above:
- (14) Full Mesh Node Slots
- (2) Rear pluggable PEM interfaces
- (2) Rear Pluggable System Management Modules
- (2) Rear Pluggable Power Entry Modules
Shelf Management SMM04 (two per system):
- Dual redundant shelf management modules
- Rear pluggable
- Pluggable into backplane
- Based on Pigeon Point or Motorola technology
