Sealevel Systems, Inc. COM Express Module, Type 6, 1.7GHz Intel Core i7 IBR-i7-3517UE

Description
The IBR-i7-3517UE COM Express Type 6 module features an Intel Core i7-3517UE dual-core 1.7GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40 – +85C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays. Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed. Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management and compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.
Description
The IBR-i7-3517UE COM Express Type 6 module features an Intel Core i7-3517UE dual-core 1.7GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40 – +85C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays. Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed. Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management and compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

Suppliers

Company
Product
Description
Supplier Links
COM Express Module, Type 6, 1.7GHz Intel Core i7 - IBR-i7-3517UE - Sealevel Systems, Inc.
Liberty, SC, USA
COM Express Module, Type 6, 1.7GHz Intel Core i7
IBR-i7-3517UE
COM Express Module, Type 6, 1.7GHz Intel Core i7 IBR-i7-3517UE
The IBR-i7-3517UE COM Express Type 6 module features an Intel Core i7-3517UE dual-core 1.7GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40 – +85C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays. Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed. Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management and compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

The IBR-i7-3517UE COM Express Type 6 module features an Intel Core i7-3517UE dual-core 1.7GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40 – +85C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays.

Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed.

Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management and compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

Supplier's Site

Technical Specifications

  Sealevel Systems, Inc.
Product Category Computer-on-Module (COM)
Product Number IBR-i7-3517UE
Product Name COM Express Module, Type 6, 1.7GHz Intel Core i7
Form Factor COM Express Basic
Processor / CPU Intel Core™ Duo
Ports / Buses PCIe
Unlock Full Specs
to access all available technical data

Similar Products

Intel® Core™ 2 Duo or Celeron® M processor based Type II COM Express module with DDR2 SDRAM, VGA, Gigabit Ethernet and USB - PCOM-B212VG - American Portwell Technology Inc.
Specs
Form Factor COM Express Basic
Processor / CPU Intel® Core 2 Duo / Celeron®
Ports / Buses PCI; PCIe; SATA; USB
View Details
Production-ready System on Module based on Qualcomm QCS5430 - MitySOM-QC5430 System on Module - Critical Link, LLC
Specs
Form Factor System-On-Module (SOM)
Processor / CPU QCS5430 SoC Processor
Ports / Buses I2C; PCIe; SPI; USB; MIPI, UART, SPI, eMMC, I3C, QLINK, SoundWire, GPIO
View Details
COM Express Module, Type 6, 1.6GHz Intel Core i3 - IBR-i3-3217UE - Sealevel Systems, Inc.
Specs
Form Factor COM Express Basic
Processor / CPU Intel Core™ Duo
Ports / Buses PCIe
View Details
Rugged Intel® Core™ i7/i5 CPU - XCOM-6400 - Acromag, Inc.
Specs
Form Factor COM Express Basic
Processor / CPU Intel Core™ i7 or i5
Ports / Buses I2C; PCIe; SATA; SPI; USB; LPC, SMBus
View Details