PI's Fast Multichannel Photonics Alignment (FMPA) solutions combine application-optimize
d, fab-ready, highly dynamic alignment stages with sophisticated controllers that integrate the world's most advanced and effective first-light search, profile, and power optimization alignment algorithms. Reduction of alignment time by 99% This award-winning technology addresses the number one cost driver for photonics test and assembly: the precise alignment required for each element and channel. Legacy alignment technologies date back to the 1980s and can take minutes to complete. PI's fast optical alignment solutions reduce the time required by typically 99%, routinely completing the task in less than one second. Studies show that up to 80% of the cost of a photonic device is attributable to alignment, without FMPA. If this 80% share of costs is reduced by 99%, the benefits to the manufacturing industry are obvious. And with projections of three orders of magnitude escalation in demand for photonic devices in the near future, as new applications and devices emerge, FMPA is a true enabler. Compact solution for XYZ alignment challenges This compact solution integrates a high-precision XYZ stage (based on model M-122) for generous travel with an XYZ piezo nano positioner of extraordinary speed and resolution (based on model P-616). A single controller manages all axes in single-sided and double-sided configurations: F-713.MA1 and F-713.MA2. Four high-resolution analog inputs provide connectivity to power meters, such as PI's F-712.PM1 high-bandwidth optical power meter, for optimization and profiling, enabling efficient and fast automated fiber alignment. Soft limits are supported to ensure process safety. Starting with these sophisticated platforms, it is easy to configure automated alignment solutions of unprecedented speed that support functionalities such as submicron-sensitive wafer proximity automation. Application fields PIC production; photonics alignment; alignment of optical components or lenses; silicon photonics wafer probing; testing, assembly, and packaging of photonics and fiber optics
PI's Fast Multichannel Photonics Alignment (FMPA) solutions combine application-optimized, fab-ready, highly dynamic alignment stages with sophisticated controllers that integrate the world's most advanced and effective first-light search, profile, and power optimization alignment algorithms. Reduction of alignment time by 99% This award-winning technology addresses the number one cost driver for photonics test and assembly: the precise alignment required for each element and channel. Legacy alignment technologies date back to the 1980s and can take minutes to complete. PI's fast optical alignment solutions reduce the time required by typically 99%, routinely completing the task in less than one second. Studies show that up to 80% of the cost of a photonic device is attributable to alignment, without FMPA. If this 80% share of costs is reduced by 99%, the benefits to the manufacturing industry are obvious. And with projections of three orders of magnitude escalation in demand for photonic devices in the near future, as new applications and devices emerge, FMPA is a true enabler. Compact solution for XYZ alignment challenges This compact solution integrates a high-precision XYZ stage (based on model M-122) for generous travel with an XYZ piezo nano positioner of extraordinary speed and resolution (based on model P-616). A single controller manages all axes in single-sided and double-sided configurations: F-713.MA1 and F-713.MA2. Four high-resolution analog inputs provide connectivity to power meters, such as PI's F-712.PM1 high-bandwidth optical power meter, for optimization and profiling, enabling efficient and fast automated fiber alignment. Soft limits are supported to ensure process safety. Starting with these sophisticated platforms, it is easy to configure automated alignment solutions of unprecedented speed that support functionalities such as submicron-sensitive wafer proximity automation. Application fields PIC production; photonics alignment; alignment of optical components or lenses; silicon photonics wafer probing; testing, assembly, and packaging of photonics and fiber optics
