Extended Support Program
5 year warranty protection, 24/7 support, advance replacement and more!
ADVANCED PROCESSING PERFORMANCE
If your project demands powerful, scalable, and efficient processing, along with compatibility for PCIe Gen 4 expansion, the Karbon 803 has you covered. Powered by 12th Gen Intel Core processing (formerly known as Alder Lake), Karbon 803 leverages Intel's unique hybrid core architecture, which adapts to your needs by directing the right thread to the right core. In addition to its advanced processing, Karbon 803's optional ECC memory, 4G and Wi-Fi compatibility (Wi-Fi 6e support coming soon) give you the capabilities you need now, and set your project up for success well into the future.
Looking for even more options? Explore the entire Karbon 800 Series.
ENGINEERED FOR THE EDGE
The Karbon 803 has been engineered to give you options. It balances advanced passive cooling technology with a flexible expansion bay, protecting the core components from dust and debris in the upper part of the system, while providing space for an additional 2.5" SSD and an actively cooled PCIe Gen 4 x16 expansion slot below. Rugged features include 12 to 48 V DC power input, an operating temperature range of -40 to 70°C, and testing to MIL-STD-810 shock and vibration standards. The Karbon 803 has been tested for reliable operation in industrial, medical, automotive, rail and maritime applications. Available wall, DIN rail and vibration isolating mounting kits giving a range of options for system installation. Wherever the edge of your project takes you, the Karbon 803 is engineered to perform.
CONNECT TO ANYTHING, ANYWHERE
The Karbon 803 can be configured with up to 6x 2.5 GbE LAN ports, two of which can provide power (PoE+) and include Intel vPro support for remote out-of-band (OOB) management of the system. Other connectivity includes dual DisplayPorts, 2x COM, 6x USB 3.2 Gen 2, dual SIM slots and integrated 18-pin GPIO (16-bit DIO, CAN bus, External Switch). Automotive power input and a customer-programmabl
e Microcontroller Unit (MCU) for ignition timing control, further reinforce the installation freedom the Karbon 803 provides, and puts you in control of how and where your data is captured and processed.
CELLULAR CONNECTIVITY
This system can be configured with an integrated cellular modem, pre-certified to operate on many of the world’s most popular cellular carrier networks using a SIM card. Our 4G capable hardware is ideal for today's mobile, edge computing, and Industrial Internet of Things (IIoT) applications. The wireless connectivity has been tested to operate reliably in challenging Electromagnetic Compatibility (EMC) environments (EN 300 328, EN 301 908-2, EN 301 489-17, EN 301 489-52). Many of our systems also include co-location options allowing you to implement Wi-Fi and Bluetooth, in addition to cellular connectivity, at the same time. To take advantage of cellular connectivity, simply configure your system with one of our available cellular modems and then contact your carrier to activate.
Extended Support Program
5 year warranty protection, 24/7 support, advance replacement and more!
ADVANCED PROCESSING PERFORMANCE
If your project demands powerful, scalable, and efficient processing, along with compatibility for PCIe Gen 4 expansion, the Karbon 803 has you covered. Powered by 12th Gen Intel Core processing (formerly known as Alder Lake), Karbon 803 leverages Intel's unique hybrid core architecture, which adapts to your needs by directing the right thread to the right core. In addition to its advanced processing, Karbon 803's optional ECC memory, 4G and Wi-Fi compatibility (Wi-Fi 6e support coming soon) give you the capabilities you need now, and set your project up for success well into the future.
Looking for even more options? Explore the entire Karbon 800 Series.
ENGINEERED FOR THE EDGE
The Karbon 803 has been engineered to give you options. It balances advanced passive cooling technology with a flexible expansion bay, protecting the core components from dust and debris in the upper part of the system, while providing space for an additional 2.5" SSD and an actively cooled PCIe Gen 4 x16 expansion slot below. Rugged features include 12 to 48 V DC power input, an operating temperature range of -40 to 70°C, and testing to MIL-STD-810 shock and vibration standards. The Karbon 803 has been tested for reliable operation in industrial, medical, automotive, rail and maritime applications. Available wall, DIN rail and vibration isolating mounting kits giving a range of options for system installation. Wherever the edge of your project takes you, the Karbon 803 is engineered to perform.
CONNECT TO ANYTHING, ANYWHERE
The Karbon 803 can be configured with up to 6x 2.5 GbE LAN ports, two of which can provide power (PoE+) and include Intel vPro support for remote out-of-band (OOB) management of the system. Other connectivity includes dual DisplayPorts, 2x COM, 6x USB 3.2 Gen 2, dual SIM slots and integrated 18-pin GPIO (16-bit DIO, CAN bus, External Switch). Automotive power input and a customer-programmable Microcontroller Unit (MCU) for ignition timing control, further reinforce the installation freedom the Karbon 803 provides, and puts you in control of how and where your data is captured and processed.
CELLULAR CONNECTIVITY
This system can be configured with an integrated cellular modem, pre-certified to operate on many of the world’s most popular cellular carrier networks using a SIM card. Our 4G capable hardware is ideal for today's mobile, edge computing, and Industrial Internet of Things (IIoT) applications. The wireless connectivity has been tested to operate reliably in challenging Electromagnetic Compatibility (EMC) environments (EN 300 328, EN 301 908-2, EN 301 489-17, EN 301 489-52). Many of our systems also include co-location options allowing you to implement Wi-Fi and Bluetooth, in addition to cellular connectivity, at the same time. To take advantage of cellular connectivity, simply configure your system with one of our available cellular modems and then contact your carrier to activate.
