Master Bond, Inc. One Component, Flexibilized Epoxy Resin EP19HTFL

Master Bond Polymer System EP19HTFL is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It is a one part, non mix system with "unlimited" working life at room temperature as it cures readily only at elevated temperatures to a tough, strong and chemically resistant thermoset plastic. Low viscosity facilitates handling at ambient temperatures and is particularly desirable for impregnation applications. As Master Bond Polymer System EP19HTFL is 100% reactive and does not contain any solvents or diluents and shrinkage upon cure in minimal. Recommended cure conditions are 1-2 hours at 300° (150°C), less at higher temperatures with the minimum cure temperature being 250°F. The cured material has high physical strength properties (tensile strength more than 8,000 psi), is thermally stable (heat deflection temperature more than 270°F) and has superior electrical insulation properties (volume resistivity greater than 1015 ohm cm) as well as remarkably good chemical resistant properties. Master Bond Polymer System EP19HTFL is widely used in the mechanical and in the electrical/electroni c industries as an adhesive/sealant, impregnant for porous metals and nonmetals and as a high strength, chemically resistant liner. The Master Bond Polymer System EP19HTFL can be used over the remarkably wide temperature range of -60°F to +350°F. The Master Bond Polymer System EP19HTFL has a shelf life of 4 months when stored at 75°F. The shelf life can be extended 6 months by storage at 40°F to 50°F.