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MacDermid Alpha Electronics Solutions MICROFAB ® CU1000

Description
Higher speed copper plating process for copper pillar in flip chip package, copper microbump in 3D interconnect package as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control. Product Overview The MICROFAB CU1000 process is engineered for high-speed bump and pillar applications. The product is formulated, packaged, and quality control is performed according to the needs of the semiconductor industry. Features High speed Excellent coplanarity Ease-of-use
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MICROFAB ® CU1000 -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
MICROFAB ® CU1000
MICROFAB ® CU1000
Higher speed copper plating process for copper pillar in flip chip package, copper microbump in 3D interconnect package as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control. Product Overview The MICROFAB CU1000 process is engineered for high-speed bump and pillar applications. The product is formulated, packaged, and quality control is performed according to the needs of the semiconductor industry. Features High speed Excellent coplanarity Ease-of-use

Higher speed copper plating process for copper pillar in flip chip package, copper microbump in 3D interconnect package as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control.

Product Overview

The MICROFAB CU1000 process is engineered for high-speed bump and pillar applications. The product is formulated, packaged, and quality control is performed according to the needs of the semiconductor industry.


Features

  • High speed
  • Excellent coplanarity
  • Ease-of-use
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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Name MICROFAB ® CU1000
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