Higher speed copper plating process for copper pillar in flip chip package, copper microbump in 3D interconnect package as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control.
Product Overview
The MICROFAB CU1000 process is engineered for high-speed bump and pillar applications. The product is formulated, packaged, and quality control is performed according to the needs of the semiconductor industry.
Features
MacDermid Alpha Electronics Solutions | |
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Product Category | Plating Chemicals and Anodizing Chemicals |
Product Name | MICROFAB ® CU1000 |