Next-generation high-speed copper plating process delivers high-purity deposits with cutting-edge uniformity.
Product Overview
MICROFAB SC-40 PLUS, a next-generation acid copper plating process, represents a leap forward in semiconductor manufacturing. It provides fabricators with a transformative solution that combines precision, efficiency, and ease of use. With high-speed plating capabilities of up to 2.5 µm/min, MICROFAB SC-40 PLUS delivers a high purity deposit with exceptional within-wafer, within-die and within-feature uniformity.
Innovative Copper Pillar Plating for Next-Generation Packages
MICROFAB SC-40 PLUS is designed to meet the semiconductor industry’s need for enhanced reliability and performance of advanced packages.
High Purity Deposit with Cutting-Edge Uniformity
The process is capable of high-speed plating up to 2.5 µm/min, enabling a high purity deposit with exceptional uniformity and a flat bump profile.
Versatile Chemistry Enables Ease of Use
Versatile chemistry for different AR Pillar and L/S of RDL. The process is compatible with and without a nickel barrier process, ensuring Kirkendall void-free stacks.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | MICROFAB ® SC-40 PLUS |
