MacDermid Alpha Electronics Solutions NOVAFAB ® Nanotwin Cu

Copper electrodeposited with a nano-twinned crystal orientation demonstrates superior mechanical and electrical properties and has drawn a lot of attention in the wafer-level packaging (WLP) field for Cu to Cu direct and hybrid bonding, including D2D, D2W, W2W applications. Additionally, fine line redistribution layers (RDL) plated with NOVAFAB Nanotwin Cu can benefit from improved mechanical reliability and electromigration resistance. Product Overview NOVAFAB NANOTWIN Cu is a high-purity copper electroplating process which produces a <111> oriented deposit with a high fraction of nano-twinning. It is specially formulated for use in the fabrication of pillars or pads for wafer level packaging applications that require hybrid bonding. This system enables low temperature, high reliability copper to copper interconnects for die-to-die (D2D), die-to-wafer (D2W), and wafer-to-wafer (W2W) bonding. NOVAFAB NANOTWIN Cu is a ready to use solution designed for use with soluble or insoluble anodes. The NOVAFAB NANOTWIN Cu process yields excellent thickness distribution over whole wafer surface for consistent electrical properties and bondability. Features Novel one-part additive system <111> oriented crystal structure High nanotwin density Excellent process stability Wide operating window High purity