MacDermid Alpha Electronics Solutions Wafer Bumping Metallization solutions for Semiconductor Packaging MICROFAB ® SC-40 PLUS

Product Overview MICROFAB SC-40 PLUS, a next-generation acid copper plating process, represents a leap forward in semiconductor manufacturing. It provides fabricators with a transformative solution that combines precision, efficiency, and ease of use. With high-speed plating capabilities of up to 2.5 µm/min, MICROFAB SC-40 PLUS delivers a high purity deposit with exceptional within-wafer, within-die and within-feature uniformity. Product Features Innovative Copper Pillar Plating for Next-Generation Packages MICROFAB SC-40 PLUS is designed to meet the semiconductor industry’s need for enhanced reliability and performance of advanced packages. High Purity Deposit with Cutting-Edge Uniformity The process is capable of high-speed plating up to 2.5 µm/min, enabling a high purity deposit with exceptional uniformity and a flat bump profile. Versatile Chemistry Enables Ease of Use Versatile chemistry for different Aspect Ratio (AR) Pillar and L/S of Redistribution Layer (RDL). The process is compatible with and without a nickel barrier process, ensuring Kirkendall Void (KV)-free stacks. Featured Applications Bump, Pillar and RDL MICROFAB SC-40 PLUS is suitable for bump, pillar, and RDL metallization and is compatible with or without a nickel barrier, as well as various solders such as tin silver and pure tin.