Product Overview
The MICROFAB RDLV 50, 60, and 70 processes are acid copper plating systems designed for simultaneous plating of Redistribution Layer (RDL) lines and filling of vias across a wide range of line, space, and via dimensions. These products are formulated to achieve bottom-up via filling while maintaining a flat line profile with excellent uniformity.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | MICROFAB ® RDLV Series |
| Product Name | Redistribution Layer (RDL) plating and via filling solutions |
| Chemical / Composition | Copper Plating; Tin Plating |
