Product Overview
NOVAFAB® AG-340 is a cyanide-free electroplating solution specifically engineered for Micro-Electromechani
cal Systems (MEMS) and advanced semiconductor wafer plating. This high-performance process provides superior silver deposits with excellent purity, solderability, and electrical conductivity—critica
l for MEMS device reliability. The satin-finish deposits from NOVAFAB® AG-340 are low-stress, ensuring stable performance in delicate MEMS structures and next-generation semiconductor packaging.
Product Features
Superior Deposits for Semiconductor Applications
NOVAFAB AG-340 delivers uniform, satin deposits with high purity and low sheet resistance.
Adjustable Surface Roughness
NOVAFAB AG-340 enables adjustable surface roughness characteristics.
Excellent Purity and Conductivity
NOVAFAB AG-340 deposits enable excellent purity, solderability, and conductivity, along with simple bath maintenance.
Featured Applications
Wafer Bump Features
NOVAFAB AG-340 cyanide-free electroplating process is designed to deliver superior deposits for wafer bump features.
Electrical Test
High purity and conductivity make NOVAFAB AG-340 ideal for electrical test devices.
Sintered Die Attach
Adjustable surface roughness characteristics make it ideal for integration with sintered die attach materials.
Product Overview
NOVAFAB® AG-340 is a cyanide-free electroplating solution specifically engineered for Micro-Electromechanical Systems (MEMS) and advanced semiconductor wafer plating. This high-performance process provides superior silver deposits with excellent purity, solderability, and electrical conductivity—critical for MEMS device reliability. The satin-finish deposits from NOVAFAB® AG-340 are low-stress, ensuring stable performance in delicate MEMS structures and next-generation semiconductor packaging.
Product Features
Superior Deposits for Semiconductor Applications
NOVAFAB AG-340 delivers uniform, satin deposits with high purity and low sheet resistance.
Adjustable Surface Roughness
NOVAFAB AG-340 enables adjustable surface roughness characteristics.
Excellent Purity and Conductivity
NOVAFAB AG-340 deposits enable excellent purity, solderability, and conductivity, along with simple bath maintenance.
Featured Applications
Wafer Bump Features
NOVAFAB AG-340 cyanide-free electroplating process is designed to deliver superior deposits for wafer bump features.
Electrical Test
High purity and conductivity make NOVAFAB AG-340 ideal for electrical test devices.
Sintered Die Attach
Adjustable surface roughness characteristics make it ideal for integration with sintered die attach materials.
