MacDermid Alpha Electronics Solutions Wafer Bumping Metallization solutions for Semiconductor Packaging MICROFAB ® Pure BP

Description
Product Overview MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.
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Description
Product Overview MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.
Request a Quote

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Wafer Bumping Metallization solutions for Semiconductor Packaging - MICROFAB ® Pure BP - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Wafer Bumping Metallization solutions for Semiconductor Packaging
MICROFAB ® Pure BP
Wafer Bumping Metallization solutions for Semiconductor Packaging MICROFAB ® Pure BP
Product Overview MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.

Product Overview

MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number MICROFAB ® Pure BP
Product Name Wafer Bumping Metallization solutions for Semiconductor Packaging
Chemical / Composition Hard Nickel Plating; Tin Plating; Soft / High Purity
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