SYSTEK ™ ETS SERIES -- ACID COPPER ELECTROPLATING FOR IC SUBSTRATES
MacDermid Alpha Electronics SolutionsAcid Copper Electroplating for IC SubstratesSystek ™ ETS Series
Description
Product Overview
Systek ETS features:
Fine line pattern plating down to 5/5 µm line/space
High coplanarity of traces and pads with R-Values < 2 µm
Excellent trace profile for controlled impedance
Low-stress deposit exceeds IPC Class III standards for tensile strength and elongation eliminating concerns of warpage due to metallization
MacDermid Alpha Electronics Solutions
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Description
Product Overview
Systek ETS features:
Fine line pattern plating down to 5/5 µm line/space
High coplanarity of traces and pads with R-Values < 2 µm
Excellent trace profile for controlled impedance
Low-stress deposit exceeds IPC Class III standards for tensile strength and elongation eliminating concerns of warpage due to metallization
Product Overview
Systek ETS features:
Fine line pattern plating down to 5/5 µm line/space
High coplanarity of traces and pads with R-Values < 2 µm
Excellent trace profile for controlled impedance
Low-stress deposit exceeds IPC Class III standards for tensile strength and elongation eliminating concerns of warpage due to metallization
Product Overview
Systek ETS features:
Fine line pattern plating down to 5/5 µm line/space
High coplanarity of traces and pads with R-Values < 2 µm
Excellent trace profile for controlled impedance
Low-stress deposit exceeds IPC Class III standards for tensile strength and elongation eliminating concerns of warpage due to metallization
