MacDermid Alpha Electronics Solutions PCB Process Chemicals for Circuit Formation UltraStrip LDI

Description
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.
Request a Quote
Description
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
PCB Process Chemicals for Circuit Formation - UltraStrip LDI - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
PCB Process Chemicals for Circuit Formation
UltraStrip LDI
PCB Process Chemicals for Circuit Formation UltraStrip LDI
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.

Product Overview

The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number UltraStrip LDI
Product Name PCB Process Chemicals for Circuit Formation
Chemical / Composition Tin Plating; Tin-lead Plating
Unlock Full Specs
to access all available technical data

Similar Products

Electroless Copper Plating Solutions for PCBs - M-Copper EF - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Tin Plating; Electroless
View Details
Wafer Bumping Metallization solutions for Semiconductor Packaging - MICROFAB ® GSW-200 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Hard Nickel Plating; Tin Plating
View Details
Direct Metallization Solutions for PCBs - Shadow ® Plus - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Tin Plating; Electroless
View Details
High-Throw Direct Current Acid Copper Plating - MacuSpec ™ HT 300 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Tin Plating
View Details