MacDermid Alpha Electronics Solutions PCB Process Chemicals for Circuit Formation UltraStrip LDI

Description
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.
Request a Quote
Description
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
PCB Process Chemicals for Circuit Formation - UltraStrip LDI - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
PCB Process Chemicals for Circuit Formation
UltraStrip LDI
PCB Process Chemicals for Circuit Formation UltraStrip LDI
Product Overview The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.

Product Overview

The UltraStrip product line represents our most advanced, high-performance photoresist strippers. Designed to strip fully aqueous dry film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper, tin, or tin-lead.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number UltraStrip LDI
Product Name PCB Process Chemicals for Circuit Formation
Chemical / Composition Tin Plating; Tin-lead Plating
Unlock Full Specs
to access all available technical data

Similar Products

Electroless Nickel for Memory Disk Applications - Electroless Nickel Products - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Hard Nickel Plating; Tin Plating; Electroless
View Details
Electroless Nickel for Memory Disk Applications - Enklad Zincate 100/100R - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Hard Nickel Plating; Tin Plating; Electroless
View Details
Precious Metal Plating for Electronic Connectors - Gold Strike - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Gold Plating; Hard Nickel Plating; Silver Plating; Tin Plating; Soft / High Purity
View Details
Micro-Electromechanical Systems (MEMS) - NOVAFAB ® AG-340 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Silver Plating; Tin Plating; Soft / High Purity
View Details