MacDermid Alpha Electronics Solutions Electronic Connector Plating Processes Tin Bright (MSA)

Description
Product Overview Our matte and bright high-speed tin solutions (Methanesulfonate(MS A)-based) include: Matte (MSA) High-speed, high-efficiency, low-foam electrolytes for the deposition of pure tin across a wide current density range. These low-stress deposits help mitigate whisker formation. Also available are high-efficiency, low-speed, low-foam electrolytes formulated for rack-and-barrel deposition of pure tin. These produce light-colored, fine-grain deposits with a uniform matte appearance. Bright (MSA) High-speed tin plating solutions for reel-to-reel or rack-and-barrel applications, operating across wide current density ranges. These processes produce high-brightness, low-stress deposits with low carbon occlusion.
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Description
Product Overview Our matte and bright high-speed tin solutions (Methanesulfonate(MS A)-based) include: Matte (MSA) High-speed, high-efficiency, low-foam electrolytes for the deposition of pure tin across a wide current density range. These low-stress deposits help mitigate whisker formation. Also available are high-efficiency, low-speed, low-foam electrolytes formulated for rack-and-barrel deposition of pure tin. These produce light-colored, fine-grain deposits with a uniform matte appearance. Bright (MSA) High-speed tin plating solutions for reel-to-reel or rack-and-barrel applications, operating across wide current density ranges. These processes produce high-brightness, low-stress deposits with low carbon occlusion.
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Suppliers

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Description
Supplier Links
Electronic Connector Plating Processes - Tin Bright (MSA) - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Electronic Connector Plating Processes
Tin Bright (MSA)
Electronic Connector Plating Processes Tin Bright (MSA)
Product Overview Our matte and bright high-speed tin solutions (Methanesulfonate(MS A)-based) include: Matte (MSA) High-speed, high-efficiency, low-foam electrolytes for the deposition of pure tin across a wide current density range. These low-stress deposits help mitigate whisker formation. Also available are high-efficiency, low-speed, low-foam electrolytes formulated for rack-and-barrel deposition of pure tin. These produce light-colored, fine-grain deposits with a uniform matte appearance. Bright (MSA) High-speed tin plating solutions for reel-to-reel or rack-and-barrel applications, operating across wide current density ranges. These processes produce high-brightness, low-stress deposits with low carbon occlusion.

Product Overview

Our matte and bright high-speed tin solutions (Methanesulfonate(MSA)-based) include:

Matte (MSA)
High-speed, high-efficiency, low-foam electrolytes for the deposition of pure tin across a wide current density range. These low-stress deposits help mitigate whisker formation.

Also available are high-efficiency, low-speed, low-foam electrolytes formulated for rack-and-barrel deposition of pure tin. These produce light-colored, fine-grain deposits with a uniform matte appearance.

Bright (MSA)
High-speed tin plating solutions for reel-to-reel or rack-and-barrel applications, operating across wide current density ranges. These processes produce high-brightness, low-stress deposits with low carbon occlusion.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number Tin Bright (MSA)
Product Name Electronic Connector Plating Processes
Chemical / Composition Hard Nickel Plating; Tin Plating
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