When designing the package, designers need to combine the characteristics of the actual micro-assembly process; they need to comprehensively consider the package feeding, radio frequency, thermal management, electromagnetic shielding, reliability and environmental adaptability protection in the chip layout stage, and the passive circuit components can be further integrated if necessary. If necessary, the package should be verified through microwave simulation after being designed.
| OptiSpac, Inc. | |
|---|---|
| Product Category | Electronic Packages and Lids |
| Product Name | Multi-Chip RF Function Module Hermetic Package |
| Package Material | Copper (optional feature); Tungsten (optional feature); CPC, Cu-Dia |
