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DATASHEETS
ELECTRONIC PACKAGES AND LIDS
Electronic Packages and Lids Datasheets
Electronic Packages and Lids are used in the microelectronic and fiber optic industry. Packages and lids are used to enclose electronic chips and interface with circuit boards. They are typicaly customized to customer requirements.
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Electronic Packages and Lids: Selection Guide
Electronic Packages and Lids Datasheets From:
Headquarters
Advanced Technical Ceramics Company
Chattanooga, TN
Advanced Technology Group, Inc.
United States
OptiSpac, Inc.
Santa Clarita, CA
Qnnect, formerly Hermetic Solutions Group
United States
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United States
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Aluminum Electronic Packages and Lids
Ceramic Electronic Packages and Lids
Stainless Steel Electronic Packages and Lids
