OptiSpac, Inc. Datasheets for Electronic Packages and Lids
Electronic Packages and Lids are used in the microelectronic and fiber optic industry. Packages and lids are used to enclose electronic chips and interface with circuit boards. They are typicaly customized to customer requirements.
Electronic Packages and Lids: Learn more
| Product Name | Notes |
|---|---|
| Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your... | |
| The package adopts metal cavity brazing or melt seal feed through assembly, optical tube structure. WSS package cavity is usually large, generally using the Kovar alloy plate 6-side welding cavity... | |
| The package design usually adopts ceramic ring frame high temperature brazing Kovar alloy metal sealing ring, metal heat dissipation bottom plate structure, shape structure, size and feed pipe foot number... | |
| The package design usually uses metal ring frame embedded ceramic feed through components, brazed vacuum catheter, metal heat dissipation bottom plate structure, supporting germanium window or sapphire window cover plate. | |
| The package is made of ceramic cavity internal brazing metal hot sink, external no wire packaging structure, synchronous matching with high reliable germanium window or sapphire window cover plate. Cover... | |
| The package is usually made of low-cost 10# steel material, and it can also be made of Kovar alloy materials under special requirements. This type of packaging package products use... | |
| TOSA/ROSA package usually uses the Kovar metal ring frame gold tin brazing light window, high temperature brazing ceramic feed through component, metal heat dissipation bottom plate structure. This type of... | |
| When designing the package, designers need to combine the characteristics of the actual micro-assembly process; they need to comprehensively consider the package feeding, radio frequency, thermal management, electromagnetic shielding, reliability... |