Master Bond, Inc. Low Exotherm, Two Component Epoxy EP29LP

Description
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates including optical fibers and fibrous reinforcements such as glass, aramid, and graphite. In this regard, it should be noted the EP29LP has superb optical clarity and has wide applicability in optical and fiber optic applications. The mixed viscosity is exceptionally low; about 700-800 cps. Peak exotherm for a 200 gram mass is approximately 50°C. These properties make the EP29LP ideally suited for large castings and potting applications. Service temperature range is -60°F to +250°F. Other noteworthy features include good electrical insulation properties and a good chemical resistance profile.
Request a Quote
Description
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates including optical fibers and fibrous reinforcements such as glass, aramid, and graphite. In this regard, it should be noted the EP29LP has superb optical clarity and has wide applicability in optical and fiber optic applications. The mixed viscosity is exceptionally low; about 700-800 cps. Peak exotherm for a 200 gram mass is approximately 50°C. These properties make the EP29LP ideally suited for large castings and potting applications. Service temperature range is -60°F to +250°F. Other noteworthy features include good electrical insulation properties and a good chemical resistance profile.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Low Exotherm, Two Component Epoxy - EP29LP - Master Bond, Inc.
Hackensack, NJ, USA
Low Exotherm, Two Component Epoxy
EP29LP
Low Exotherm, Two Component Epoxy EP29LP
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates including optical fibers and fibrous reinforcements such as glass, aramid, and graphite. In this regard, it should be noted the EP29LP has superb optical clarity and has wide applicability in optical and fiber optic applications. The mixed viscosity is exceptionally low; about 700-800 cps. Peak exotherm for a 200 gram mass is approximately 50°C. These properties make the EP29LP ideally suited for large castings and potting applications. Service temperature range is -60°F to +250°F. Other noteworthy features include good electrical insulation properties and a good chemical resistance profile.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates including optical fibers and fibrous reinforcements such as glass, aramid, and graphite. In this regard, it should be noted the EP29LP has superb optical clarity and has wide applicability in optical and fiber optic applications. The mixed viscosity is exceptionally low; about 700-800 cps. Peak exotherm for a 200 gram mass is approximately 50°C. These properties make the EP29LP ideally suited for large castings and potting applications. Service temperature range is -60°F to +250°F. Other noteworthy features include good electrical insulation properties and a good chemical resistance profile.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP29LP
Product Name Low Exotherm, Two Component Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
Chemical System Epoxy
Composition Unfilled
Unlock Full Specs
to access all available technical data

Similar Products

Room Temperature Curing, Toughened Two Part Epoxy - EP21TDCHT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
View Details
NASA Low Outgassing, Thermally Conductive Two Part Silicone - MasterSil 972TC-LO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Solvent Resistant Adhesive Withstands Methylene Cholride - EP41S-5 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications - MasterSil 323AO-LO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Silicone
View Details