Master Bond EP17HTDA-2 is a one component, heat cured epoxy system for bonding, sealing, and die attach. It is recommended when its exceptionally high Tg of 185-190°C is a critical factor in die attach applications.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP17HTDA-2 |
| Product Name | Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements |
| Cure / Technology | Thermoset; Single Component |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates |
| Chemical System | Epoxy |
| Composition | Unfilled |
| Features | High Dielectric; Non-corrosive; Thermally Conductive |
