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Master Bond, Inc. Two Componen,t Thermally Conductive Epoxy EP51AO

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Two Componen,t Thermally Conductive Epoxy - EP51AO - Master Bond, Inc.
Hackensack, NJ, USA
Two Componen,t Thermally Conductive Epoxy
EP51AO
Two Componen,t Thermally Conductive Epoxy EP51AO
Master Bond Polymer Adhesive EP51AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 1200 psi tensile shear. EP51AO resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -4K to +250°F. The temperature range as indicated allows EP51AO to be used in many cryogenic applications requiring good heat transfer. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP51AOLV is also available. That system is particularly well suited for certain potting applications. It is suggested that Master Bond EP51AO be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line asemblies and high speed bonding operations. A faster setting version called EP51M-AO; working life 3-5 minutes, full cure 3-4 hours, also is available.

Master Bond Polymer Adhesive EP51AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 1200 psi tensile shear. EP51AO resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -4K to +250°F. The temperature range as indicated allows EP51AO to be used in many cryogenic applications requiring good heat transfer. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP51AOLV is also available. That system is particularly well suited for certain potting applications. It is suggested that Master Bond EP51AO be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line asemblies and high speed bonding operations. A faster setting version called EP51M-AO; working life 3-5 minutes, full cure 3-4 hours, also is available.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP51AO
Product Name Two Componen,t Thermally Conductive Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
Chemical System Epoxy
Composition Unfilled
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