Master Bond, Inc. Two Part, Flexible, USP Class VI Epoxy System EP21LV3/5Med

Description
Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at room temperature and more quickly at elevated temperatures. It has a forgiving 3 to 5 mix ratio by weight or volume. The EP21LV3/5Med produces tough, high strength, durable bonds which hold up very well to thermal cycling and resist many chemicals including cold sterilants, water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -80°F to +250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21LV3/5Med is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. As a Class VI epoxy, EP21LV3/5Med is truly unique in that it cures flexible allowing it to be used in a wide range of applications where more rigid epoxies are not suitable. In addition, it meets FDA requirements for food compatibility. EP21LV3/5Med contains no solvents or diluents. The color of the cured material is amber-clear.
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Two Part, Flexible, USP Class VI Epoxy System - EP21LV3/5Med - Master Bond, Inc.
Hackensack, NJ, USA
Two Part, Flexible, USP Class VI Epoxy System
EP21LV3/5Med
Two Part, Flexible, USP Class VI Epoxy System EP21LV3/5Med
Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at room temperature and more quickly at elevated temperatures. It has a forgiving 3 to 5 mix ratio by weight or volume. The EP21LV3/5Med produces tough, high strength, durable bonds which hold up very well to thermal cycling and resist many chemicals including cold sterilants, water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -80°F to +250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21LV3/5Med is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. As a Class VI epoxy, EP21LV3/5Med is truly unique in that it cures flexible allowing it to be used in a wide range of applications where more rigid epoxies are not suitable. In addition, it meets FDA requirements for food compatibility. EP21LV3/5Med contains no solvents or diluents. The color of the cured material is amber-clear.

Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at room temperature and more quickly at elevated temperatures. It has a forgiving 3 to 5 mix ratio by weight or volume. The EP21LV3/5Med produces tough, high strength, durable bonds which hold up very well to thermal cycling and resist many chemicals including cold sterilants, water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -80°F to +250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21LV3/5Med is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. As a Class VI epoxy, EP21LV3/5Med is truly unique in that it cures flexible allowing it to be used in a wide range of applications where more rigid epoxies are not suitable. In addition, it meets FDA requirements for food compatibility. EP21LV3/5Med contains no solvents or diluents. The color of the cured material is amber-clear.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP21LV3/5Med
Product Name Two Part, Flexible, USP Class VI Epoxy System
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy
Features Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Gap Filler, Foam in Place Gasket
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