Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at room temperature and more quickly at elevated temperatures. It has a forgiving 3 to 5 mix ratio by weight or volume. The EP21LV3/5Med produces tough, high strength, durable bonds which hold up very well to thermal cycling and resist many chemicals including cold sterilant, water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -80°F to +250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21LV3/5Med is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. As a Class VI epoxy, EP21LV3/5Med is truly unique in that it cures flexible allowing it to be used in a wide range of applications where more rigid epoxies are not suitable. In addition, it meets FDA requirements for food compatibility. EP21LV3/5Med contains no solvents or diluents. The color of the cured material is amber-clear.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP21LV3/5Med |
| Product Name | Two Part, Flexible, USP Class VI Epoxy System |
| Cure / Technology | Thermoset; Two Component |
| Type / Form | Liquid |
| Substrate Compatibility | Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood |
| Chemical System | Epoxy |
| Features | Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Gap Filler, Foam in Place Gasket |
