MacDermid Alpha Electronics Solutions Via Dep ® 4550

Electroless copper system for difficult-to-plate substrates, offering superior adhesion while maintaining structural integrity. Product Overview Via Dep® 4550 electroless copper system is specially designed for difficult-to-plate substrates. The 4550 process offers superior adhesion on inert surfaces and difficult structural designs while maintaining structural integrity. The zero-stress, blister-free deposit for SAP, mSAP, and flex applications ensures metallization needs on complicated hybrid devices can be met with ease. Via Dep 4550 H is formulated for horizontal lines. Stress Free Copper Deposit Via Dep 4550 passes IPC-TM-650 thermal stress testing for plated through-holes. Enabling Difficult-to-Plate Substrates Compatible with flex, rigid-flex, and rigid PCB designs for complex hybrid devices. Delivering Operating Cost Efficiencies Via Dep 4550 operates at low temperatures, enabling reduced operating costs. The system is also a drop-in replacement for existing electroless copper lines.