High-speed low-alpha pure tin plating process produces compact grain structures and uniform surface morphology.
Product Overview
The MICROFAB SN-300/302 process is a high-speed, MSA-based pure tin plating solution. It produces fine-grained, matte to semi-bright pure tin deposits. The formulation is designed to provide excellent thickness distribution across the wafer and uniform alloy distribution for wafer bumps.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | MICROFAB ® SN-300/302 |
