MacDermid Alpha Electronics Solutions MICROFAB ® SN-300 / 302

MICROFAB SN-300 / 302 is a high-speed low alpha pure tin plating process that produces compact grain structures and uniform surface morphology which is used for flip chip bumping and microbump applications. Product Overview MICROFAB SN-300 / 302 process is a high speed, MSA based pure Tin process. MICROFAB SN-300 / 302 produces fine-grained, matte to semi-bright pure tine deposit. The formulation is developed to produce wafer bumps with excellent thickness distribution across the wafer, as well as a uniform alloy distribution. Features Pure tin Low alpha Matte High Speed Lead-free