MacDermid Alpha Electronics Solutions MICROFAB ® SC-50

High speed copper plating process for copper pillar in flip chip package, copper microbump in 3D interconnect package as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control. Product Overview The MICROFAB SC-50 process is engineered as a high-speed, low stress solution capable of flat bump shape. It provides good within-wafer, within-die, and within-feature uniformity in a two-part organic package. MICROFAB SC-50 shares family lineage with MICROFAB SC with the added feature of higher plating rates. Features High speed Good coplanarity Versatility Ease-of-use High throughput