Super throwing power solution that enables increased throwing power in high aspect through-hole plating.
Product Overview
CUPROSTAR ST-2000 is a direct current acid copper plating process that delivers high throwing power at current densities up to 30 ASF in through holes with aspect ratios up to 15:1. This increased throwing power, combined with higher current density capability, enables greater throughput while minimizing excess surface copper and extending the performance limits of standard DC plating.
The deposits exceed IPC Class 3A tensile strength and elongation requirements and pass all thermal reliability testing, ensuring dependable device performance.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | Cuprostar ST-2000 |
| Chemical / Composition | Copper Plating |
