Product Overview
Systek MV 400 is a Direct Current (DC) acid copper pattern plating process specifically designed for 2-in-1 Redistribution Layer (RDL) applications. It consistently fills vias without voids and plates surface features such as traces and pads with excellent coplanarity in a single step at high current densities. The production proven, three-component system is fully Cyclic Voltammetric Stripping (CVS) analyzable.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | Systek ™ MV 400 |
| Product Name | Acid Copper Electroplating for IC Substrates |
| Chemical / Composition | Copper Plating; Tin Plating |
