MacDermid Alpha Electronics Solutions Molded Interconnect Device Plating Enplate ® LDS AG 600

Product Overview Delivering consistent selectivity on a wide variety of materials and catalysts, our final finish solutions enable more complex designs on low-cost molding composites. This easy-to-control process offers steady plating rates and predictable bath performance. The ENPLATE® LDS NI 200 provides a complete and compelling alternative to nickel/gold as a final finish. Designers and manufacturers can realize significant cost savings through the elimination of gold and nickel, while achieving exceptional electrical performance. Our unique technology ensures that environmental and corrosion resistance meet end-use requirements