MacDermid Alpha Electronics Solutions Redistribution Layer for Wafer Level Packaging NEUTRONEX 309

Product Overview NEUTRONEX 309 is an alkaline, non-cyanide gold electroplating process specifically optimized for Redistribution Layer (RDL) applications in Wafer-Level Packaging (WLP). Designed for advanced semiconductor manufacturing, it delivers high-purity, uniform gold deposits for filters, opto-semiconductors, and power management devices. A thallium-free variant is also available, ensuring safety and regulatory compliance while maintaining excellent electrical and mechanical performance.