MacDermid Alpha Electronics Solutions Periodic Pulse Reverse Plating for PCBs MacuSpec ™ PPR 100 & 200

Product Overview MacuSpec PPR 100 and 200 are industry-leading pulse plating processes trusted by fabricators worldwide who demand precise thickness uniformity and overall productivity that conventional acid copper plating cannot achieve. These processes are designed for the metallization of high-tech panels with through-hole aspect ratios approaching 30:1. Product Features Exceptional Thickness Uniformity Uniform copper distribution allows for a reduction in dry film thickness, resulting in lower operating costs. Reliable Thermal Cycle Performance Increased thermal cycling performance for enhanced reliability in today’s multilayer Printed Circuit Boards (PCBs). Superior Throwing Power The processes provide superior throwing power into high-aspect ratio through-holes, reducing plating time by up to 70%. Featured Applications Complex PCB Designs Excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power for the most challenging plating specifications.