MacDermid Alpha Electronics Solutions Direct Metallization Solutions for PCBs Shadow ® Plus

Product Overview Shadow Plus is a graphite-based, patented wet-etch direct metallization technology designed to provide enhanced reliability for high-density applications. It enables the plating of microvias and through holes using graphite-based colloids and proprietary additives to make the holes conductive. The technology is our most advanced alternative to electroless copper, delivering faster throughput and significant sustainability benefits. Product Features Enhanced Reliability and Performance Shadow Plus enhances reliability through direct copper-to-copper bonding with fewer interfaces, eliminating nano-voiding. Efficient, Stable Process with Reduced Sludging Compared to Other Direct Metallization Processes Shadow Plus is an easy-to-control, 3-chemical step process that uses less power and operates at lower temperatures than electroless copper. Proven Sustainability Benefits over Electroless Copper The technology delivers a significant reduction in waste generation, water, power, and chemical consumption, while eliminating hazardous chemicals such as formaldehyde and Ethylenediaminetetra acetic Acid (EDTA). In addition, wet-etch technology allows for further reductions in water and power usage compared to older generation direct metallization processes. Featured Applications High-Density Designs Shadow Plus is ideal for advanced substrates with high aspect ratios, blind, buried, and stacked vias, tight lines and spaces, and more. PCB Applications Shadow Plus can be used in a wide variety of PCB applications across the automotive, mobile device, telecom, server, and military/aerospace markets.