Product Overview
MICROFAB CUMSA100 enables high plating rates for high throughput, leading to a lower cost of ownership. This is achieved through a low consumption additive and simple, easy bath maintenance. The process produces equiaxed-grained matte copper deposits and is specially formulated for the fabrication of bumps/pillars on semiconductor wafers. High-build bumps/pillars can be produced on fine semiconductor patterns for excellent performance.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | MICROFAB ® CUMSA100 |
| Product Name | Wafer Bumping Metallization solutions for Semiconductor Packaging |
| Chemical / Composition | Hard Nickel Plating; Tin Plating; Soft / High Purity |
