Product Overview
MICROFAB AU310-T is a mild alkaline non-cyanide gold electroplating process that produces deposits of 99.99% purity. It enables an arsenic-free bright plating solution with superior surface roughness for fine pitch pattern gold bumping. Frequently used in bump plating on metalized silicon wafers.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | MICROFAB ® AU310-T |
| Product Name | Redistribution Layer for Wafer Level Packaging |
| Chemical / Composition | Tin Plating; Soft / High Purity |
