Product Overview
MICROFAB MP-2500 is a high-speed copper plating process engineered for mega pillar applications, delivering exceptional Within-Die (WID) and Within-Feature (WIF, TIR) uniformity.
Product Features
Excellent Uniformity for Thermal Pillar Applications
MICROFAB MP-2500 achieves high-speed plating rates, delivering high-purity bumps with excellent coplanarity for enhanced reliability.
Increased Throughput and Yields
MICROFAB MP-2500 enables high throughput, a flat bump shape, and low Kirkendall Void (KV) capability.
Featured Applications
Mega Pillar
Smaller form factors and integration technologies are driving the demand for highly co-planar and flat features to achieve high reliability and yield.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Number | MICROFAB ® MP-2500 |
| Product Name | Wafer Bumping Metallization solutions for Semiconductor Packaging |
| Chemical / Composition | Copper Plating; Hard Nickel Plating; Tin Plating; Soft / High Purity |
